晶圓BG膠帶貼膜機/撕膜機 BG Tape/ Detap

ALD 原子積層塗佈設備

Diffusion Furnace 擴散爐

表面張力分析儀 接觸角 Surface Tension Analysis System, Contact Angle

步進投影光刻機 Stepper Exposure

晶圓鍵合機 Wafer Bonder

晶圓鍵合機

銅柱/solder 電鍍機 Cu pillar/solder bump electroplating

銅柱/solder 電鍍機

晶圓Die Saw膠帶貼膜機 Wafer Mounter

晶圓背面貼膜機 Back Side Lamination

晶圓轉Cassette 機 Wafer Sorter

E-Beam Lithography System 電子束影顯微系統

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3D 立體掃描顯微鏡 3D- SEM

表面張力分析儀 接觸角 Surface Tension Analysis System, Contact Angle

表面輪廓儀 Surface Profiler

全光譜橢偏儀 測厚儀 Spectroscopic Ellisometer, Spectroscopic Reflectometer

原子力顯微鏡 Atomic Force Microscope

300SA Semi-Auto Prober

Multi-Site Parallel Wafer-Level Probing System

MIRA-Package & wafer-level Mulit-Application testing

ACE-Package level pulse EM and BTS testing

EM or BTS Full AC Version

Infinity-Package & wafer-level TDDB & HC testing

雷射切割機 Laser Dicing System

Wafer Sorting, Packing, Unpacking 晶圓分片 包裝 拆裝機

Wafer Macro & Micro Optical Inspection 晶圓外觀檢測機

3rd Optical Inspection System 第三光學檢測機

Wafer UV Eraser 晶圓UV紫外光清除機

超音波 鋁片/銅片 接合機 Ultrasonic Metal-S Bonder

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超音波 鋁/銅線 銲接機 Ultrasonic Wire Bonder

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Laser Marking System, CO2 / Fiber 雷射打印機

Mixed Signal IC & Discrete Test System IC混合信號/分立器件,測試主機

Discrete DC Tester 分立器件 直流測試機

Sorter With unicon Visual Inspection System 晶粒挑選測試機

WLCSP die sorter with 5S vision check 晶粒外觀分選機

Non-Contact Dispenser 非接觸式點膠系統

Die & Wire Bonder 黏晶機 打線機

Wind Tunnel, Still Box, Thermal test wafer 風洞, 靜置箱, 熱組測試晶片

風洞,靜置箱, 熱組測試晶片

Transducer Test System & Optical Displacement Measurement System (for Ultrasonic Die/Wire Bonder)

振盪器測試系統/光學振盪位移量測系統 (超音波貼片/打線機)

Bonding Pad/Metal Stamping

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打線墊片/預成型金屬片

Bonding Wires (Au, Al, Cu, Ag)

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打線機/貼片機用線材

Diffusion Paper, SOD, SOG

擴散源 (磷紙, 硼紙, 旋佈式液態源, 固態源)

Ink Marking Consumables 油墨蓋印耗材

Solder Preform

焊片

MicroE Encoder

Feedthrough, Thermocouple, Viewport, …

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電引入, 熱電耦, 視窗等真空專用接頭

Precision Motor, Linear Actuator

Bonding Wedge

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打線鋼嘴

Bellows Valve, Diaphragm Valve, Check Valve

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Dispensing Component

點膠針筒、耗材

Megasonic Generator/ Transducer

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兆聲波發振源/ 發振器

IC Test / Burn in Socket IC 手測 / Burn in 測試座

3500種SOCKET產品,最小間距(PITCH)0.22 MM 各類QFN,CSP,BGA, TO, SOIC SOCKET

Burn In boards / Load boards

Contact Pin Assembly 測試金手指

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