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MIRA-Package & wafer-level Mulit-Application testing3
首頁 商品介紹 封裝測試設備 Assembly and Test MIRA-Package & wafer-level Mulit-Application testing
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MIRA-Package & wafer-level Mulit-Application testing


The MIRA modular system allows for a wide variety of configurations to met testing requirements for EM, Contact EM, Stress Migration, TDDB, QBD, ILD, BTS, SILC, HC, NBTI, AC HC, and Bipolar HC. Any combination of four similar or different application modules can be accommodated by the MIRA mainframe. The following modules and options are available for the MIRA system.

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