Home Products Assembly and Test List | Image 300 SA Semi-Auto Prober Multi-Site Parallel Wafer-Level Probing System MIRA-Package & wafer-level Multi-Application testing ACE-Package level pulse EM and BTS testing EM or BTS Full AC Version Infinity-Package & wafer-levl TDDB & HC testing Laser Dicing System 6/8/12 Wafer Sorting / Packing / Unpacking 晶圓分片/包裝/拆裝機 Wafer Macro & Micro Optical Inspection 3rd Optical Inspection System 第三光學檢測機 Wafer UV Eraser 晶圓紫外光清除機 Ultrasonic REBO- Metal-S Bonder 原廠網站連結: Click here Ultrasonic REBO-9 Wire Bonder 原廠網站連結: Click here 打線機 Sorter With unicon Visual Inspection System WLCSP die sorter with 5S vision check Beatrum Non-contact Jet Dispenser Non-Contact Dispenser 非接觸式點膠系統 Die & Wire Bonder Wind Tunnel, Still Box, Thermal test wafer