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Home Products Assembly and Test MIRA-Package & wafer-level Multi-Application testing
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MIRA-Package & wafer-level Multi-Application testing

The MIRA modular system allows for a wide variety of configurations to met testing requirements for EM, Contact EM, Stress Migration, TDDB, QBD, ILD, BTS, SILC, HC, NBTI, AC HC, and Bipolar HC. Any combination of four similar or different application modules can be accommodated by the MIRA mainframe. The following modules and options are available for the MIRA system.

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