🔧 Wire Bonding Capabilities & Specifications
• Supports three bonding types: 45° wedge, 90° wedge, and ball bonding
• Z-axis travel range: 14.3 mm
• Z-axis resolution: 25 μm
• Adjustable dual-point bonding force
• Bonding force range: 10 to 250 g (adjustable)
• Compatible wire diameter: 0.7 to 3.0 mil (Au/Al)
• Equipped with a 3-axis micromanipulator; all axes are linear, mutually orthogonal, and lockable during bonding
• Supports both ultrasonic and thermocompression bonding
• Can store up to 30 sets of bonding parameters for different components
🏢 Ideal Applications
Designed for use in corporate R&D departments or academic laboratories.
Suitable for wire bonding of:
● Microwave components
● Semiconductors
● RF devices
● LEDs
● Hybrid components