The "3D sintering equipment" is a system that uses our unique 3D press method to sinter bond SiC chips to substrates in the process of bonding SiC power semiconductors, which are rapidly being adopted for use in EVs. The three-dimensional press using the special elastomer enables uniform batch bonding of chips of different heights to substrates, thus enabling more efficient and higher quality module manufacturing than the conventional metal press method that presses on a flat surface.