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Wafer Bonder

SMEE

Wafer Aligner/Bonder —— IC Back-end Manufacturing

SWA.jpgSWA Series Wafer Aligner SWB.jpgSWB Series Wafer Bonder SWDB.jpgSWDB Series Wafer Debonder

SWA series are wafer alignment equipments specifically designed for wafer bonding process. SWA aligner can meet alignment requirements of various types of substrates.SWB series are bonding equipments developed for substrate bonding in the semiconductor processes. SWB series have a wide range of applications, covering many different substrate bonding processes, such as organic adhesive bonding, glass frit bonding, eutectic bonding, and anodic bonding, etc. SWDB series are thermal slide debonding equipments for thin wafer handling applications, used in the process of removing thinned wafers from temporary carriers.
u177.png    Product Features

● High accuracy alignment

● Flexible alignment mode

● Warped wafer and ultra thick wafer compatibility

● High accuracy temperature control

● High accuracy pressure control

● Flexible options

u177.png    Specifications

 Wafer Aligner

 SWA200/30

 SWA300/30

Wafer Size

 200mm

 300mm

Alignment Accuracy

 ±2um

 ±2um

 

Wafer Bonder

 SWB200/30

 SWB300/30

Wafer Size

 200mm

 300mm

Max Contact Force

15KN100KN optional

30KN100KN optional

Max Bonding Temperature

 250550optional

250550optional

Anodic Bonding

0-2000V/50mAoptional

0-2000V/50mAoptional

 

Wafer Debonder

SWDB200/10

SWDB300/10

Wafer Size

 200mm

 200mm/300mm

Max Debonding Temperature

 300℃

 300℃


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