鴻碩企業有限公司 Great Domain Enterprise Co., Ltd.
產品
MIRA-Package & wafer-level Mulit-Application testing
電洽
The MIRA modular system allows for a wide variety of configurations to met testing requirements for EM, Contact EM, Stress Migration, TDDB, QBD, ILD, BTS, SILC, HC, NBTI, AC HC, and Bipolar HC. Any combination of four similar or different application modules can be accommodated by the MIRA mainframe. The following modules and options are available for the MIRA system.
