|
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Mask Aligner System |
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Evaporator System |
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ICP RIE
System |
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PECVD System |
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Wafer Bonding System |
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Sputter System |
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Plasma Stripper System |
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LED
Chip Mapping Sorter |
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LED
Chip Probe Station |
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LED
AOI Sorter |
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LED
Die Bonder |
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Spin Coater |
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Wet Bench |
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Spin Dryer |
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Spectroscopic Reflectometer |
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Ellisometer |
|
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Surface Profiler |
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Sapphire Substrate |
|
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| ¡¡ |
|
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Mask Aligner |
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Developer/Wet Bench |
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EPI Wafer |
|
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E-Gun Deposition |
|
Bonder |
|
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Plasma Stripper |
|
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E-Beam Lithography System |
|
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Atomic Force Microscope |
|
|
3D- SEM |
|
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Die & Wire Bonder |
|
| 1 |
Laser dicing system |
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Au/Al/Cu Wires |
|
| ¡¡ |
|
Grinding, Lapping |
|
| ¡¡ |
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Laser Scriber |
|
| ¡¡ |
|
Dicing Saw |
|
| ¡¡ |
|
SRD(Spin Rings Dryer) |
|
| ¡¡ |
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Ellipsometer |
|
| ¡¡ |
|
LED Dispenser |
|
| ¡¡ |
|
LED Wafer Grinding/Lapping/Polishing Machine |
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