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MIRA-Package & wafer-level Mulit-Application testing


The MIRA modular system allows for a wide variety of configurations to met testing requirements for EM, Contact EM, Stress Migration, TDDB, QBD, ILD, BTS, SILC, HC, NBTI, AC HC, and Bipolar HC. Any combination of four similar or different application modules can be accommodated by the MIRA mainframe. The following modules and options are available for the MIRA system.

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封装测试设备 Assembly and Test 1081245