鸿硕企业有限公司 Great Domain Enterprise Co., Ltd.-晶圆键合机 Wafer Bonder
商品介绍
首页 制程设备 Equipment,Process 晶圆键合机 Wafer Bonder

晶圆键合机 Wafer Bonder

晶圆键合机

SMEE
Wafer Aligner/Bonder —— IC Back-end Manufacturing

SWA.jpgSWA Series Wafer Aligner SWB.jpgSWB Series Wafer Bonder SWDB.jpgSWDB Series Wafer Debonder

SWA series are wafer alignment equipments specifically designed for wafer bonding process. SWA aligner can meet alignment requirements of various types of substrates.SWB series are bonding equipments developed for substrate bonding in the semiconductor processes. SWB series have a wide range of applications, covering many different substrate bonding processes, such as organic adhesive bonding, glass frit bonding, eutectic bonding, and anodic bonding, etc. SWDB series are thermal slide debonding equipments for thin wafer handling applications, used in the process of removing thinned wafers from temporary carriers.
u177.png    Product Features

● High accuracy alignment

● Flexible alignment mode

● Warped wafer and ultra thick wafer compatibility

● High accuracy temperature control

● High accuracy pressure control

● Flexible options

u177.png    Specifications

 Wafer Aligner

 SWA200/30

 SWA300/30

Wafer Size

 200mm

 300mm

Alignment Accuracy

 ±2um

 ±2um

 

Wafer Bonder

 SWB200/30

 SWB300/30

Wafer Size

 200mm

 300mm

Max Contact Force

15KN100KN optional

30KN100KN optional

Max Bonding Temperature

 250550optional

250550optional

Anodic Bonding

0-2000V/50mAoptional

0-2000V/50mAoptional

 

Wafer Debonder

SWDB200/10

SWDB300/10

Wafer Size

 200mm

 200mm/300mm

Max Debonding Temperature

 300℃

 300℃


订阅最新消息订阅最新消息 订阅商品讯息订阅商品讯息 手机版 
Powered by www.url.com.tw